Enpirion has qualified wire bond material for QFN devices. The device assembly will be done by HANA Semiconductor, Thailand.
| Publish Date | 20 February 2023 |
|---|---|
| PCN Number | 770074 |
| PCN Title | Enpirion PCN ENP-PCN-2010-01 Rev 1 |
| Description | Enpirion has qualified wire bond material for QFN devices. The device assembly will be done by HANA Semiconductor, Thailand. |
| Upstream PDF | PCN-770074.pdf |
| Intel Website URL | PCN 770074 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/770074.json |