{
	"title": "Enpirion PCN ENP-PCN-2010-01 Rev 1",
	"id": "770074",
	"created_at": "2023-02-20T18:06:56+00:00",
	"modified_at": "2010-04-12T07:00:00+00:00",
	"description": "Enpirion has qualified wire bond material for QFN devices. The device assembly will be done by HANA Semiconductor, Thailand.",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/770074?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/770074/enpirion-pcn-enp-pcn-2010-01-rev-1.html",
	"url": "https://intel.pcn.captnemo.in/pcn/770074",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/770074.json"
}