Intel® is announcing a change to the RDL/Bump site and package appearance on selected Intel MAX® 10 products in Wafer Level Chip Scale Package (WLCSP
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677814 |
| PCN Title | PCN2124 Intel® MAX® 10 WLCSP RDL/Bump Site Transfer and Package Appearance Change |
| Description | Intel® is announcing a change to the RDL/Bump site and package appearance on selected Intel MAX® 10 products in Wafer Level Chip Scale Package (WLCSP |
| Upstream PDF | PCN-677814.pdf |
| Intel Website URL | PCN 677814 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677814.json |