{
	"title": "PCN2124 Intel® MAX® 10 WLCSP RDL/Bump Site Transfer and Package Appearance Change",
	"id": "677814",
	"created_at": "2021-10-12T16:19:02+00:00",
	"modified_at": "2021-05-28T07:00:00+00:00",
	"description": "Intel® is announcing a change to the RDL/Bump site and package appearance on selected Intel MAX® 10 products in Wafer Level Chip Scale Package (WLCSP",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/677814?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677814/pcn2124-intel-max-10-wlcsp-rdl-bump-site-transfer-and-package-appearance-change.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677814",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677814.json"
}