Altera® is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® FineLine BGA® (FBGA) device packages
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677783 |
| PCN Title | PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES |
| Description | Altera® is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® FineLine BGA® (FBGA) device packages |
| Upstream PDF | PCN-677783.pdf |
| Intel Website URL | PCN 677783 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677783.json |