{
	"title": "PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES",
	"id": "677783",
	"created_at": "2021-10-12T16:16:44+00:00",
	"modified_at": "2006-01-12T08:00:00+00:00",
	"description": "Altera® is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® FineLine BGA® (FBGA) device packages",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/677783?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677783/pcn0515-mold-compound-change-for-fbga-packages.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677783",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677783.json"
}