Intel® Programmable Solutions Group (“Intel® PSG”, formerly Altera®) is announcing a change in mold compound for selected Cyclone® and Cyclone® II devices in TQFP 100/144 and QFP208 packages assembled at Advanced Semiconductor Engineering Inc., Malaysia (ASEM)
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677769 |
| PCN Title | PCN1717 Mold Compound Change for Selected Cyclone® and Cyclone® II devices in TQFP100/144 and QFP208 Packages |
| Description | Intel® Programmable Solutions Group (“Intel® PSG”, formerly Altera®) is announcing a change in mold compound for selected Cyclone® and Cyclone® II devices in TQFP 100/144 and QFP208 packages assembled at Advanced Semiconductor Engineering Inc., Malaysia (ASEM) |
| Upstream PDF | PCN-677769.pdf |
| Intel Website URL | PCN 677769 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677769.json |