{
	"title": "PCN1717 Mold Compound Change for Selected Cyclone® and Cyclone® II devices in TQFP100/144 and QFP208 Packages",
	"id": "677769",
	"created_at": "2021-10-12T16:15:58+00:00",
	"modified_at": "2017-11-10T08:00:00+00:00",
	"description": "Intel® Programmable Solutions Group (“Intel® PSG”, formerly Altera®) is announcing a change in mold compound for selected Cyclone® and Cyclone® II devices in TQFP 100/144 and QFP208 packages assembled at Advanced Semiconductor Engineering Inc., Malaysia (ASEM)",
	"download_url": "https://docs.altera.com/api/khub/documents/L68EagGqAESvN24D8nmyUQ/content",
	"original_url": "https://cdrdv2.intel.com/v1/dl/getContent/677769?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677769/pcn1717-mold-compound-change-for-selected-cyclone-and-cyclone-ii-devices-in-tqfp100-144-and-qfp208-packages.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677769",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677769.json"
}