Altera® is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array (PBGA) packaged devices
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677759 |
| PCN Title | PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES |
| Description | Altera® is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array (PBGA) packaged devices |
| Upstream PDF | PCN-677759.pdf |
| Intel Website URL | PCN 677759 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677759.json |