{
	"title": "PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES",
	"id": "677759",
	"created_at": "2021-10-12T16:15:19+00:00",
	"modified_at": "2005-12-23T08:00:00+00:00",
	"description": "Altera® is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array (PBGA) packaged devices",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/677759?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677759/pcn0516-mold-compound-change-for-pbga-packages.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677759",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677759.json"
}