The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera® devices in thin quad flat pack (TQFP) 144 lead packages assembled by Amkor Technology Korea
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677738 |
| PCN Title | PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE |
| Description | The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera® devices in thin quad flat pack (TQFP) 144 lead packages assembled by Amkor Technology Korea |
| Upstream PDF | PCN-677738.pdf |
| Intel Website URL | PCN 677738 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677738.json |