{
	"title": "PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE",
	"id": "677738",
	"created_at": "2021-10-12T16:13:51+00:00",
	"modified_at": "2004-03-05T08:00:00+00:00",
	"description": "The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera® devices in thin quad flat pack (TQFP) 144 lead packages assembled by Amkor Technology Korea",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/677738?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677738/pcn0404-additional-mold-compound-for-tqfp-144-package.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677738",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677738.json"
}