Altera® will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera®’s Thin Quad Flat Pack (TQFP) packages
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677544 |
| PCN Title | PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES |
| Description | Altera® will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera®’s Thin Quad Flat Pack (TQFP) packages |
| Upstream PDF | PCN-677544.pdf |
| Intel Website URL | PCN 677544 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677544.json |