{
	"title": "PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES",
	"id": "677544",
	"created_at": "2021-10-12T15:59:10+00:00",
	"modified_at": "2004-11-17T08:00:00+00:00",
	"description": "Altera® will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera®’s Thin Quad Flat Pack (TQFP) packages",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/677544?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/677544/pcn0414-standardized-eme-g700-mold-compound-for-tqfp-packages.html",
	"url": "https://intel.pcn.captnemo.in/pcn/677544",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/677544.json"
}