Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
| Publish Date | 21 December 2023 |
|---|---|
| PCN Number | 807213 |
| PCN Title | Intel(R) Flip Chip Ball Grid Array (FCBGA1, FCBGA3, FCBGA5) Chipsets and Advanced Memory Buffer (AMB), PCN 108251-01, Product Material, solder resist material change, Reason for Revision: Change in substrate delivery schedule |
| Description | Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Product Material, Intel anticipates no impact to customers, see PCN detail for further information. |
| Upstream PDF | PCN-807213.pdf |
| Intel Website URL | PCN 807213 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/807213.json |