132 lead Ceramic BGA Package (CBGA) 16 mil Solder Ball, Product Discontinuance, Revision to Original PCN 1141-03 to notify correction to Last Time Order Date.

Product Discontinuance,Please determine your remaining demand for these products and place your "last product discontinuance orders" in accordance with the "key milestones" in the PCN

Publish Date 19 December 2023
PCN Number 798979
PCN Title 132 lead Ceramic BGA Package (CBGA) 16 mil Solder Ball, Product Discontinuance, Revision to Original PCN 1141-03 to notify correction to Last Time Order Date.
Description Product Discontinuance,Please determine your remaining demand for these products and place your "last product discontinuance orders" in accordance with the "key milestones" in the PCN
Upstream PDF PCN-798979.pdf
Intel Website URL PCN 798979 on Intel.com
Type Product Discontinuance Notices (PDN);
API URL /api/798979.json