Altera® will be standardizing on Sumikon EME-G700 series mold compound in Altera®’s quad flat pack (QFP) packages
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677857 |
| PCN Title | PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES |
| Description | Altera® will be standardizing on Sumikon EME-G700 series mold compound in Altera®’s quad flat pack (QFP) packages |
| Download PDF | PCN-677857.pdf |
| Original URL | https://cdrdv2.intel.com/v1/dl/getContent/677857?explicitVersion=true |
| Intel Website URL | PCN 677857 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677857.json |