Intel® is discontinuing part numbers that currently use leaded solder bumps on the 1st level interconnect for the following Field Programmable Gate Array® (FPGA) Flip Chip product families
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677825 |
| PCN Title | PRODUCT DISCONTINUANCE NOTIFICATION PDN2007 |
| Description | Intel® is discontinuing part numbers that currently use leaded solder bumps on the 1st level interconnect for the following Field Programmable Gate Array® (FPGA) Flip Chip product families |
| Upstream PDF | PCN-677825.pdf |
| Intel Website URL | PCN 677825 on Intel.com |
| Type | Product Discontinuance Notices (PDN); |
| API URL | /api/677825.json |