Intel® is discontinuing part numbers with leaded solder balls as 2nd level interconnect and eutectic Tin-Lead bumps for 1st level interconnect for the following Field Programmable Gate Array (FPGA) Flip Chip product families
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677791 |
| PCN Title | PRODUCT DISCONTINUANCE NOTIFICATION PDN2009 |
| Description | Intel® is discontinuing part numbers with leaded solder balls as 2nd level interconnect and eutectic Tin-Lead bumps for 1st level interconnect for the following Field Programmable Gate Array (FPGA) Flip Chip product families |
| Upstream PDF | PCN-677791.pdf |
| Intel Website URL | PCN 677791 on Intel.com |
| Type | Product Discontinuance Notices (PDN); |
| API URL | /api/677791.json |