This is an update to PCN0708, published July 2007. Altera® is implementing encapsulant material changes on the ball-grid array (BGA) Pb-free packages assembled in Amkor Korea and Philippines
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677781 |
| PCN Title | PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES |
| Description | This is an update to PCN0708, published July 2007. Altera® is implementing encapsulant material changes on the ball-grid array (BGA) Pb-free packages assembled in Amkor Korea and Philippines |
| Download PDF | PCN-677781.pdf |
| Original URL | https://cdrdv2.intel.com/v1/dl/getContent/677781?explicitVersion=true |
| Intel Website URL | PCN 677781 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677781.json |