ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677778 |
| PCN Title | PCN0119 FineLine BGA Package Molding Compound Change |
| Description | ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100 |
| Upstream PDF | PCN-677778.pdf |
| Intel Website URL | PCN 677778 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677778.json |