The substrate for the 88 Lead Ultra FineLine BGA® package assembled by Sharp will change from polyimide tape to glass epoxy FR4. This change does not affect form, fit, or function
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677747 |
| PCN Title | PCN0407 UFBGA 88 PACKAGE SUBSTRATE CHANGE |
| Description | The substrate for the 88 Lead Ultra FineLine BGA® package assembled by Sharp will change from polyimide tape to glass epoxy FR4. This change does not affect form, fit, or function |
| Upstream PDF | PCN-677747.pdf |
| Intel Website URL | PCN 677747 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677747.json |