Altera® is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677736 |
| PCN Title | PCN0808 WIRE-BOND DIAMETER REDUCTION FOR SELECTED TQFP PACKAGES |
| Description | Altera® is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package |
| Upstream PDF | PCN-677736.pdf |
| Intel Website URL | PCN 677736 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677736.json |