Altera® is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack (PQFP) and Plastic Thin Quad Flat Pack (TQFP) packaged devices
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677687 |
| PCN Title | PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE™ II PQFP & TQFP PACKAGES |
| Description | Altera® is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack (PQFP) and Plastic Thin Quad Flat Pack (TQFP) packaged devices |
| Upstream PDF | PCN-677687.pdf |
| Intel Website URL | PCN 677687 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677687.json |