Intel® Programmable Solutions Group (“Intel® PSG", formerly Altera®) is announcing a conversion from Molded Underfill to Capillary Underfill in Thermal Composite Flip Chip Ball Grid Array® (BGA) on Arria®II GX and Arria®V devices with the “G” OPN suffix.
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677673 |
| PCN Title | PCN1801 Capillary Underfill for Thermal Composite Flip Chip Ball Grid Array® (BGA) Packages on Selected Arria®II GX and Arria®V Devices |
| Description | Intel® Programmable Solutions Group (“Intel® PSG", formerly Altera®) is announcing a conversion from Molded Underfill to Capillary Underfill in Thermal Composite Flip Chip Ball Grid Array® (BGA) on Arria®II GX and Arria®V devices with the “G” OPN suffix. |
| Upstream PDF | PCN-677673.pdf |
| Intel Website URL | PCN 677673 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677673.json |