The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera® FineLine BGA® packages assembled at ASE Malaysia
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677655 |
| PCN Title | PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA |
| Description | The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera® FineLine BGA® packages assembled at ASE Malaysia |
| Upstream PDF | PCN-677655.pdf |
| Intel Website URL | PCN 677655 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677655.json |