Altera® is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array (BGA), Ultra FineLine Ball-Grid Array® (UBGA), Micro FineLine Ball-Grid Array® (MBGA), and FineLine Ball-Grid Array® (FBGA) packages assembled in both Amkor and ASE manufacturing sites
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677648 |
| PCN Title | PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES |
| Description | Altera® is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array (BGA), Ultra FineLine Ball-Grid Array® (UBGA), Micro FineLine Ball-Grid Array® (MBGA), and FineLine Ball-Grid Array® (FBGA) packages assembled in both Amkor and ASE manufacturing sites |
| Upstream PDF | PCN-677648.pdf |
| Intel Website URL | PCN 677648 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677648.json |