This is an update to PCN0702, published March, 2007. Altera® is implementing mold compound material changes on the Plastic Quad Flat Pack (PQFP), Plastic Dual In-Line Package (PDIP), and Power Quad Flat Pack (RQFP) packages assembled in Amkor Philippines and Korea
| Publish Date | 12 October 2021 |
|---|---|
| PCN Number | 677530 |
| PCN Title | PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES |
| Description | This is an update to PCN0702, published March, 2007. Altera® is implementing mold compound material changes on the Plastic Quad Flat Pack (PQFP), Plastic Dual In-Line Package (PDIP), and Power Quad Flat Pack (RQFP) packages assembled in Amkor Philippines and Korea |
| Upstream PDF | PCN-677530.pdf |
| Intel Website URL | PCN 677530 on Intel.com |
| Type | Product Change Notifications (PCN); |
| API URL | /api/677530.json |