Intel(R) Flip Chip Ball Grid Array (FCBGA1, FCBGA3, FCBGA5) Chipsets and Advanced Memory Buffer (AMB), PCN 108251-01, Product Material, solder resist material change, Reason for Revision: Change in substrate delivery schedule
Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
| Publish Date | 10 April 2008 |
|---|---|
| PCN Number | 108251-01 |
| PCN Title | Intel(R) Flip Chip Ball Grid Array (FCBGA1, FCBGA3, FCBGA5) Chipsets and Advanced Memory Buffer (AMB), PCN 108251-01, Product Material, solder resist material change, Reason for Revision: Change in substrate delivery schedule |
| Key Characteristics | Product Material |
| Product Categories | Chipsets - Desktop, Chipsets - Workstation Server, Chipsets - Mobile |
| Complete PCN PDF | https://QDMS.intel.com/dm/i.aspx/35B23CAF-D3C0-42E9-89FA-287248E50615/PCN108251-01.pdf |
| API URL | /api/108251-01.json |
| Alternate PDF URL (redirect) |
/pcn/108251-01/pdf
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