Intel(R) High Speed PHY Products, PCN 108194-00, Product Material, Change in Mold Compound and Bonding Wire
Networking Products, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.
| Publish Date | 08 January 2008 |
|---|---|
| PCN Number | 108194-00 |
| PCN Title | Intel(R) High Speed PHY Products, PCN 108194-00, Product Material, Change in Mold Compound and Bonding Wire |
| Key Characteristics | Product Material |
| Product Categories | Networking Products |
| Complete PCN PDF | https://QDMS.intel.com/dm/i.aspx/6E02B18B-B991-41CE-A985-6B93CDC6F5AF/PCN108194-00.pdf |
| API URL | /api/108194-00.json |
| Alternate PDF URL (redirect) |
/pcn/108194-00/pdf
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