{
	"title": "MINOR CHANGEPackaging Change Made to Intermediate Box (I-Box) Cardboard Flaps for Closure and Intel Logo Change on i-Box, PCN 117758-00, Transport Media, Product Material, Transport Media, Half NSD I-Box Overlap Inner Flap design change + Logo Change",
	"id": "812098",
	"created_at": "2023-12-21T21:20:54+00:00",
	"modified_at": "2020-11-24T22:00:00+00:00",
	"description": "Chipsets - Desktop, Chipsets - Mobile, Chipsets - Mobile IMC, Chipsets - Workstation Server, Compute Module, Desktop Processors, Embedded Processors, FPGA (Field-Programmable Gate Array), Mobile Processors, Server Processors, Transport Media, Intel antici",
	"download_url": "https://cdrdv2-public.intel.com/812098/PCN117758-00.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/812098/minor-changepackaging-change-made-to-intermediate-box-i-box-cardboard-flaps-for-closure-and-intel-logo-change-on-i-box-pcn-117758-00-transport-media-product-material-transport-media-half-nsd-i-box-overlap-inner-flap-design-change-logo-change.html",
	"url": "https://intel.pcn.captnemo.in/pcn/812098",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/812098.json"
}