{
	"title": "Enpirion  Product Change Notice - ENP-PCN-2011-02 - Material Change",
	"id": "720834",
	"created_at": "2022-02-03T02:06:48+00:00",
	"modified_at": "2011-09-12T07:00:00+00:00",
	"description": "Enpirion is converting to copper wire as a qualified wire bond material for device packaging: EN5310DC, EN5310DI, EN5330DC, EN5330DI",
	"download_url": "https://cdrdv2.intel.com/v1/dl/getContent/720834?explicitVersion=true",
	"html_url": "https://intel.com/content/www/us/en/content-details/720834/enpirion-product-change-notice-enp-pcn-2011-02-material-change.html",
	"url": "https://intel.pcn.captnemo.in/pcn/720834",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/720834.json"
}